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计算机工程 ›› 2019, Vol. 45 ›› Issue (10): 57-63. doi: 10.19678/j.issn.1000-3428.0052444

• 体系结构与软件技术 • 上一篇    下一篇

基于区域划分的非全互连3D NoC多播路由算法

孙美东, 刘勤让, 刘崇阳   

  1. 国家数字交换系统工程技术研究中心, 郑州 450002
  • 收稿日期:2018-08-20 修回日期:2018-10-07 出版日期:2019-10-15 发布日期:2018-10-15
  • 作者简介:孙美东(1993-),男,硕士研究生,主研方向为片上网络路由算法;刘勤让,研究员、博士;刘崇阳,硕士研究生。
  • 基金资助:
    国家科技重大专项(2016ZX01012101);国家自然科学基金(61572520,61521003)。

Non-fully Interconnected 3D NoC Multicast Routing Algorithm Based on Region Partition

SUN Meidong, LIU Qinrang, LIU Chongyang   

  1. China National Digital Switching System Engineering and Technological R & D Center, Zhengzhou 450002, China
  • Received:2018-08-20 Revised:2018-10-07 Online:2019-10-15 Published:2018-10-15

摘要: 针对非全互连三维片上网络中多播路由算法传输路径长且易发生网络拥塞的问题,提出一种基于区域划分的多播路由算法。根据目的节点的分布将数据包传输方式分为层间传输和层内传输。在层间传输时,数据包选择硅通孔(TSV)表中最近的TSV作为传输通道。在层内传输时,根据源节点位置坐标划分网络区域,将源节点所在行作为公共路径,在该路径上传输携带目的节点地址的初始包。在此基础上,进行目的地址列检查和数据包复制。实验结果表明,与3D LADPM算法、3D HOE算法相比,该算法能够缩短传输时延,降低网络丢包率。

关键词: 三维片上网络, 多播路由, 区域划分, 硅通孔, 公共路径

Abstract: To address the problem of long transmission path and tendency of network congestion of existing multicast routing algorithm in non-fully interconnected 3D Network-on-Chip(3D NoC),a multicast routing algorithm based on region partition is proposed.According to the distribution of destination nodes,data packet transmission is divided into inter-layer transmission and intra-layer transmission.For inter-layer transmission,the nearest Through-Silicon-Via(TSV) in the TSV table is selected as the transmission channel.For intra-layer transmission,the network area is divided according to the coordinates of the source node,and then the rows of the source node are regarded as common path on which the initial packets carrying the addresses of the destination nodes are transmitted.On this basis,destination address column checking and packet replication are carried out.Experimental results show that compared with the 3D LADPM algorithm and the 3D HOE algorithm,the proposed algorithm can shorten the transmission delay and reduce the network packet loss rate.

Key words: 3D Network-on-Chip(3D NoC), multicast routing, region partition, Through-Silicon-Via(TSV), common path

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