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计算机工程 ›› 2006, Vol. 32 ›› Issue (23): 229-231. doi: 10.3969/j.issn.1000-3428.2006.23.082

• 工程应用技术与实现 • 上一篇    下一篇

面向工程的SoC技术及其挑战

冯亚林1,2,张蜀平2   

  1. (1. 北京大学微电子研究院,北京100871; 2. 北京市122信箱9室,北京 100036 )
  • 收稿日期:1900-01-01 修回日期:1900-01-01 出版日期:2006-12-05 发布日期:2006-12-05

Techniques and Challenges of Engineering SoC

FENG Yalin1,2, ZHANG Shuping2   

  1. (1. Institute of Microelectronics, Peking University, Beijing 100871; 2. The 9th Group, P. O. Box No.122, Beijing 100036)
  • Received:1900-01-01 Revised:1900-01-01 Online:2006-12-05 Published:2006-12-05

摘要: 系统集成芯片(SoC)是21世纪集成电路的发展方向,它以IP核复用技术、超深亚微米工艺技术和软硬件协同设计技术为支撑,是系统集成和微电子设计领域的一场革命。该文阐述了SoC的设计与验证、IP的开发与复用以及工程化SoC所面临的超深亚微米下的物理综合、软硬件协同设计、低功耗设计、可测性设计和可重用技术等方面的挑战。

关键词: 集成电路, 系统集成芯片, 知识产权核, 超深亚微米, 协同设计

Abstract: As a development direction of IC in 21st century, SoC, based on IP core reusing technique, very deep sub-micron technique, co-design of software and hardware technique, is a revolution in system integration and microelectronic design. The challenges in design and verification of SoC, development and reuse of IP core and physical synthesis in very deep sub-micron, co-design of software and hardware, low pawer design, design for test and reusability technique of engineering oriented SoC are described.

Key words: Integration circuit, System on Chip(SoC), IP core, Very deep sub-micron, Co-design