Abstract: To obtain better multi-objective performances of the Interbay material handling system in wafer fabrication, a novel hybrid intelligence-based dispatching approach for the Interbay material handling system is proposed. The weight coefficients of wafer lots’ transportation cost model are adjusted adaptively by Takagi-Sugeno based fuzzy logic method. The optimized dispatching solution between wafer lots and transport vehicles is obtained based on Hungarian algorithm. Experimental results demonstrate that the proposed approach has better comprehensive performances of the Interbay material handling system and SMS than traditional dispatching approaches.

Key words: wafer fabrication, Interbay system, scheduling, multi-objective, Hungarian method, fuzzy logic

摘要： 为提高晶圆制造Interbay物料运输系统的多目标调度性能，提出一种混合智能的Interbay系统调度方法。采用Takagi-Sugeno模糊逻辑方法对晶圆卡运输成本模型的参数权重进行自适应调节，用匈牙利方法对Interbay系统的运输小车和晶圆工件进行优化指派。实验结果表明，该方法在Interbay系统和晶圆加工系统的多目标综合性能方面优于传统方法。

关键词: 晶圆制造, Interbay系统, 调度, 多目标, 匈牙利方法, 模糊逻辑

CLC Number: 

• TH166