Abstract: Based on the analysis of the structure and the key technologies of smart card Mini_COS on 3G network, a cover model of smart card Bind_Max_COS is proposed, the structure and the construction process of this model are studies. A smart card Bind_Mini_COS which suits for the customs taste is made. And a feasibility analysis and evaluation for this model are described.

Key words: binding, Mini_COS, Bind_Max_COS, cover model

摘要： 在分析3G网络下单晶片智能卡芯片操作系统(COS)的结构及关键技术基础上，提出绑定式多晶片智能卡COS的覆盖模型，对模型各功能模块结构及构造流程进行研究。通过对模型的裁剪，抽象出符合用户需求的绑定式单晶片智能卡COS模型，并对模型进行可行性分析及评估。

关键词: 绑定式, 单晶片操作系统, 多晶片操作系统, 覆盖模型

CLC Number: 

• TP311