摘要： 针对印刷电路板(PCB)设计中布局造成散热性差和布线造成抗噪声性差，导致PCB的抗干扰性弱的问题，提出一种布局布线协同算法，基于元胞自动机思想，以温度为基准，对元件进行位置调动，使元件的放置符合演化规则的定态要求，从而使布局的散热性能达到要求，同时运用优化蚁群算法对当前布局以路径最短及通孔数最小化为目标进行布线，并评价其抗噪声性能。实验结果表明，从散热性方面调整布局，散热性能提高14%左右，从抗噪声性能方面考虑布线，平均路径长度与通孔数下降明显，PCB板的总平均温度降低14%左右。
关键词:
散热性,
抗噪声性,
蚁群算法,
元胞自动机,
抗干扰性,
印刷电路板设计
Abstract: It is the problem that weak immunity of Printed Circuit Board(PCB) resulted by the low thermal dissipation performance with unreasonable layout and the low noise immunity performance without optimization wiring. To attack the problem, an algorithm based on collaboration between the layout and the wiring is proposed. The algorithm adopts the rule based on Cellular Automata(CA) transfers the position of components according to temperature limitation for layout so that the heat dissipation performance of layout can be more reasonable and the method is proposed based on Ant Colony Algorithm(ACA) looks for the shortest routing length and the minimum number of holes and evaluates PCB noise immunity performance for wiring. Experimental result shows that performance of heat dissipation is increased by 14% on the aspect of heat dissipation for the layout, the average routing length and number of holes are decreased obviously on the aspect of noise immunity for the wiring and the PCB total average temperature is decreased by 14%.
Key words:
heat dissipation,
noise immunity,
Ant Colony Algorithm(ACA),
cellular automata,
interference immunity,
Printed Circuit Board(PCB) design
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