摘要: 系统集成芯片(SoC)是21世纪集成电路的发展方向,它以IP核复用技术、超深亚微米工艺技术和软硬件协同设计技术为支撑,是系统集成和微电子设计领域的一场革命。该文阐述了SoC的设计与验证、IP的开发与复用以及工程化SoC所面临的超深亚微米下的物理综合、软硬件协同设计、低功耗设计、可测性设计和可重用技术等方面的挑战。
关键词:
集成电路,
系统集成芯片,
知识产权核,
超深亚微米,
协同设计
Abstract: As a development direction of IC in 21st century, SoC, based on IP core reusing technique, very deep sub-micron technique, co-design of software and hardware technique, is a revolution in system integration and microelectronic design. The challenges in design and verification of SoC, development and reuse of IP core and physical synthesis in very deep sub-micron, co-design of software and hardware, low pawer design, design for test and reusability technique of engineering oriented SoC are described.
Key words:
Integration circuit,
System on Chip(SoC),
IP core,
Very deep sub-micron,
Co-design
冯亚林;张蜀平. 面向工程的SoC技术及其挑战[J]. 计算机工程, 2006, 32(23): 229-231.
FENG Yalin; ZHANG Shuping. Techniques and Challenges of Engineering SoC[J]. Computer Engineering, 2006, 32(23): 229-231.