摘要： 为满足高密度多厂商集成协议(H-MVIP)和串行电信总线(ST-BUS)在通信领域中的应用需求，提出两者之间的双向通信解决方案。采用状态机结合硬件描述语言的设计方式，在现场可编程门阵列上实现整个方案，包括同步、接收、缓存、总线生成与转换、监测等模块。实验结果证明了该方案的可行性。

关键词: 高密度多厂商集成协议, 串行电信总线, 状态机, 现场可编程门阵列

Abstract: In order to meet the application demands of H-MVIP and ST-BUS in communication field, this paper proposes a bi-directional communication scheme between H-MVIP and ST-BUS. It uses HDL language combined with state machine as design entry, the whole design is implemented in FPGA chip, including synchronization, receiving, buffering, bus generation and conversion, monitoring, etc. Experimental results show the feasibility of this scheme.

Key words: H-MVIP, ST-BUS, state machine, FPGA

中图分类号: 

• TP303