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›› 2003, Vol. 29 ›› Issue (21): 160-162.

• 论文 • 上一篇    下一篇

印刷电路板装联过程中元器件贴装的优化模型

曾又姣,金烨,严隽琪   

  1. 上海交通大学CIM研究所,上海交通大学CIM研究所,上海交通大学CIM研究所 上海 200030 , 上海 200030
  • 发布日期:2003-11-15

An Optimisation Modle of Component Placement Process in Printed Circuit Board Assembly

ZENG Youjiao, JIN Ye, YAN Junqi   

  1. (CIM Research Institute, Shanghai Jiaotong University, Shanghai 200030)
  • Published:2003-11-15

摘要: 针对贴片机贴装元器件时所需解决的两个彼此相关的关键问题(供料器位置分配 问题和元器件取贴顺序问题)提出一种优化模型;根据这一模型使用一种有效的算法并用软 件实现;通过在一台4头贴片机上所做的实验来验证该模型及其解决方法,其结果令人满意 。

关键词: 印刷电路板, 贴片机, 优化模型, 供料器位置分配, 元器件取贴顺序

Abstract: This paper introduces an optimisation model to solve two related es sential problems, namely feeder assignment problem and pick-and-place sequence d etermination problem, on a multiple head surface mounted technology placement ma chine. The paper uses one effective approach and implements it as a computer pro gram. Experiment on a real four-head placement machine is performed. The experim ental results are presented to analyse their performance.

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