计算机工程 ›› 2010, Vol. 36 ›› Issue (8): 230-232.doi: 10.3969/j.issn.1000-3428.2010.08.081

• 工程应用技术与实现 • 上一篇    下一篇

硬件构件的形式化描述及其组装机制

黄万伟,兰巨龙,于 婧,李 鹏   

  1. (国家数字交换系统工程技术研究中心,郑州 450002)
  • 收稿日期:1900-01-01 修回日期:1900-01-01 出版日期:2010-04-20 发布日期:2010-04-20

Hardware Component Formal Specification and Its Composition Architectures

HUANG Wan-wei, LAN Ju-long, YU Jing, LI Peng   

  1. (National Digital Switching System Engineering & Technological R&D Center, Zhengzhou 450002)
  • Received:1900-01-01 Revised:1900-01-01 Online:2010-04-20 Published:2010-04-20

摘要: 针对构件化的路由交换平台设计,提出硬件基础构件的抽象模型及其内部处理流程的形式化描述,提取出顺序、并行、分支以及聚合4种原子组装机制,用于构建更高层次的复合构件,并推导出复合构件抽象模型及其处理流程的形式化描述,从而有利于抽象出更大粒度的构件用以组装复杂的硬件平台。

关键词: 基础构件, 形式化描述, 原子组装, 复合构件, 粒度

Abstract: An abstract model of hardware basic component is presented to design router and switch platform based on components, providing formal specification of disposal process inside the basic component, four atomic composition architectures used to construct higher layer compound component are described in formal semantic, including sequential architecture, parallel architecture, embranchment architecture and polymerization architecture, providing the abstract model and formal specifications of disposal process inside the compound component. The proposed approach offers a facility to construct compound hardware platform by components with higher granularity.

Key words: basic component, formal specification, atomic composition, compound component, granularity

中图分类号: