Abstract:
According to the characteristics of Ball Grid Array(BGA) chip mounted technology, analyzing the characteristics of chip solder balls arranged, a technology of BGA chip detection centring based on machine vision technology is proposed in this paper. Including the gray value histogram processing, dynamic threshold segmentation, system designs detection technology in VC platform combined with machine vision software, and it verifies the feasibility of this technology. Experimental results show that this technology improves the accuracy of the chip detection, guarantees the calculation speed, and is able to deal with nonlinear illumination.
Key words:
Ball Grid Array(BGA),
surface mounting,
machine vision,
threshold processing,
detection centring,
welding
摘要： 根据球栅阵列(BGA)结构芯片贴装技术的特点，分析芯片锡球排列的特征，提出一种基于机器视觉技术的BGA芯片检测对中技术。包括灰度值直方图处理、动态阈值分割技术，并结合机器视觉软件在VC开发平台下验证其可行性。实验结果表明，该技术能提高芯片对中检测的准确性，较好地处理非线性光照。
关键词:
球栅阵列,
表面贴装,
机器视觉,
阈值处理,
检测对中,
焊接
CLC Number:
LIU Hua-Beng, CHEN Yi-Chang, DIAO Chang-Long, HE Li-Yun. BGA Chip Detection Centring Technology Based on Machine Vision[J]. Computer Engineering, 2013, 39(8): 281-284.
刘学平, 陈艺昌, 刁常龙, 贺丽云. 基于机器视觉的BGA芯片检测对中技术[J]. 计算机工程, 2013, 39(8): 281-284.